As CMOS scales down to sub-50 nm, it faces critical dimensions of charge and matter granularities, leading to the drastic increase of device parameter dispersion, named statistical variability, which is one of the main contemporary challenges for further downscaling and makes each device atomistically different leading to broad dispersion of their electrical characteristics. In addition, device reliability concerns gain inertia; among them Bias Temperature Instability (BTI) shortens device lifetime by trapping charges in defect states of the insulator or at the interface. The interplay between statistical variability and BTI results in more variations on device performance and thus greatly affect circuit performance. In turn design methodologies must evolve towards variability and reliability aware design. To do so statistical compact models including both the effects of statistical variability and BTI-induced ageing are required for the large-scale statistical circuit simulation of variability and reliability.
In this study, the application of accurate compact models, that describe performance variation in the presence of both statistical variability and reliability at arbitrary BTI-induced ageing levels, to SRAM circuit simulation is described. Both SRAM cell stability and write performance are evaluated and it is seen that, due to the accurate description of device performance distributions provided by the compact models and the sensitivity of these SRAM performance metrics on device performance, the approach presented here is better suited to high-sigma statistical circuit analysis than conventional approaches based upon assumed Gaussian distributions. The approach is demonstrated using a 25 nm gate length bulk MOSFET whose performance variation is obtained from statistical TCAD simulation using the GSS simulator GARAND. The simulated performance data is then used directly as the target for BSIM4 compact model extraction that ensures device figures of merit are well resolved for each device in a statistical ensemble. The distribution of compact model parameters is then generalised into an algebraic form using Generalized Lambda Distribution (GLD) methods, so that a sufficiently large number of compact models can later be generated and interpolated at arbitrary ageing levels. Finally compact models generated in this way are used to evaluate SRAM write performance and stability under the influence of statistical variability and BTI-induced ageing.
Item Type: | Thesis (PhD) |
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Qualification Level: | Doctoral |
Additional Information: | Funded from James Watt Scholarship and European project MORDRED. |
Keywords: | CMOS, Compact Model, SRAM |
Subjects: | > |
Colleges/Schools: | > > |
Supervisor's Name: | Asenov, Professor Asen |
Date of Award: | 2015 |
Depositing User: | |
Unique ID: | glathesis:2015-6864 |
Copyright: | Copyright of this thesis is held by the author. |
Date Deposited: | 09 Nov 2015 13:23 |
Last Modified: | 07 Dec 2015 13:53 |
URI: |
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One week after teasing a European version of its Casper A-segment sub-compact EV called the INSTER, Hyundai Motor Group has officially unveiled the new mini-car, which holds a lot of potential with consumers. In addition to its sleek yet compact size, Hyundai promises the INSTER EV will hit Europe (and several other markets) at a starting price below 25,000 euros.
Today’s unveiling of the INSTER EV was inspired by Casper. No, not the friendly ghost, but the combustion vehicle from Hyundai that has been built and sold in South Korea since 2021. Last week, Hyundai teased an incoming all-electric version of the Casper as a “new standard for popularizing electric vehicles.”
Given its compact size and estimated affordability in the A-segment of vehicles, the Casper EV holds excellent potential for success, hence is why Hyundai is expanding its availability outside of Korea.
During the Casper EV announcement, Hyundai also shared its plans to offer the minicar in Europe, rebranded as the “INSTER.” Hyundai Motor Group has now unveiled the INSTER EV alongside some features and specs that future consumers in Europe will be able to take advantage of.
Hyundai shared a press release detailing the new INSTER EV’s entry into Europe after officially unveiling the sub-compact during the 2024 Busan International Mobility Show earlier today.
By removing the combustion components in the original Casper vehicle, Hyundai’s redesign of the INSTER has enabled an extended body and wheelbase for more interior space. As a result, Hyundai shared the new BEV has found a sweet spot in the market between traditional A-segment sub-compact city cars and larger B-segment compacts.
The new Hyundai EV’s compact size makes it perfect for city driving and parking, two critical factors for driving in Europe. The INSTER comes standard with a 42 kWh battery pack, but customers can also upgrade to a long-range 49 kWh battery.
All versions feature a single motor that delivers 71.1 kW (~95 hp) in the base model and jumps to 84.5 kW (113 hp) in the long-range version. Either variant can create 147 Nm (108 lb-ft) of torque. Hyundai shared that the INSTER EV will offer a projected WLTP range of 300+ km (186 miles) in the standard version and up to 355km (221 miles) with the larger long-range battery (with 15″ wheels).
Other features include Vehicle-to-Load (V2L) capabilities, battery preconditioning, and an optional heat pump. Hyundai still needs to share the exact pricing of the INSTER EV for Europe, but it has previously stated that it will be priced below 25,000 euros ($26,750).
Hyundai has promised more details as it approaches launching the new EV, which will arrive in Korea this summer before expanding to markets in Europe, the Middle East, and the Asia Pacific “in due course.”
Hyundai also teased a new variant of the new sub-compact called the INSTER CROSS in the works, described as having a “more rugged, outdoor-focused design.”
What do you think? Could this be another slam dunk for Hyundai Motor Group? Let us know in the comments below.
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Portfolio managers have conflicting incentives as the economic and financial risks from climate change become more apparent but remain imprecise.
Credit... Edmon de Haro
Supported by
By Lydia DePillis
A team of economists recently analyzed 20 years of peer-reviewed research on the social cost of carbon, an estimate of the damage from climate change. They concluded that the average cost, adjusted for improved methods, is substantially higher than even the U.S. government’s most up-to-date figure.
That means greenhouse gas emissions, over time, will take a larger toll than regulators are accounting for. As tools for measuring the links between weather patterns and economic output evolve — and the interactions between weather and the economy magnify the costs in unpredictable ways — the damage estimates have only risen.
It’s the kind of data that one might expect to set off alarm bells across the financial industry, which closely tracks economic developments that might affect portfolios of stocks and loans. But it was hard to detect even a ripple.
In fact, the news from Wall Street lately has mostly been about retreat from climate goals, rather than recommitment. Banks and asset managers are withdrawing from international climate alliances and chafing at their rules. Regional banks are stepping up lending to fossil fuel producers. Sustainable investment funds have sustained crippling outflows , and many have collapsed .
So what explains this apparent disconnect? In some cases, it’s a classic prisoner’s dilemma: If firms collectively shift to cleaner energy, a cooler climate benefits everyone more in the future. But in the short term, each firm has an individual incentive to cash in on fossil fuels, making the transition much harder to achieve.
And when it comes to avoiding climate damage to their own operations, the financial industry is genuinely struggling to comprehend what a warming future will mean.
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COMMENTS
sistor model is necessary to simulate circuits in multiple-gate MOSFET technologies. In this dissertation research, a compact multiple-gate MOSFET model, BSIM-MG is devel-oped. BSIM-MGincludesindependentmulti-gatecompactmodelBSIM-IMGandcommon multi-gate compact model BSIM-CMG. We focus on BSIM-IMG for multiple-gate MOS-
The short channel effect, ferroelectric variability, and spacer optimization design are the focus in this thesis. The compact model of NCFET is improved to be more predictive for ferroelectric properties with verification against TCAD simulations. Monte-Carlo method is carried out in FE variability study, where the main finding is that the ...
which are significantly faster than compact models based on the physics of a device or system. The second contribution of this thesis is the implementation of a novel MOSFET model in Verilog-A. This MOSFET model is known as the Virtual Source model. Thesis Supervisor: Luca Daniel Title: Emmanuel E. Landsman Associate Professor of Electrical ...
An accurate and computationally efficient compact transistor model is necessary to simulate circuits in multiple-gate MOSFET technologies. In this dissertation research, a compact multiple-gate MOSFET model, BSIM-MG is developed. ... %0 Thesis %A Lu, Darsen %T PhD Dissertation: Compact Models for Future Generation CMOS %I EECS Department ...
Reduced order models are a class of purely mathematical compact models, which are significantly faster than compact models based on the physics of a device or system. The second contribution of this thesis is the implementation of a novel MOSFET model in Verilog-A. This MOSFET model is known as the Virtual Source model.
List of Figures 2.1 Top and cross sectional views of the Y-branch device. The process variations that this thesis focuses on are identi ed in Figure 2.1b ...
Overview. Editors: Gennady Gildenblat. A comprehensive book on compact models of most commonly used semiconductor devices. Each chapter is covered by an expert, often responsible for the widely used model with wide industrial applications. Both traditional and experimental devices are covered. Critical variability issues are addressed.
physics-based compact modeling using Verilog-A. Verilog-A models allow a great flexibility in describing de-vice behavior. Scope of the Thesis The work to be performed in the scope of this thesis is roughly divided in the following topics: •Extending the compact model of planar-gate to trench-gate SiC power MOSFETs (30 %)
Thesis. Dec 2011; L. Negre; ... (Al2O3) is considered. As a compact model, the modified model of a conventional diode on the p-n junction is used. The procedure is proposed for extraction of Spice ...
Abstract and Figures. In this thesis, we develop compact models for the essential physical phenomenons present in advanced technology nodes in FinFET, UTBB-FDSOI and negative capacitance FDSOI FET ...
The distribution of compact model parameters is then generalised into an algebraic form using Generalized Lambda Distribution (GLD) methods, so that a sufficiently large number of compact models can later be generated and interpolated at arbitrary ageing levels. ... PhD thesis, University of Glasgow. Full text available as: PDF Download (40MB ...
enable efficient GaN-based RF circuit design, computationally efficient physics based compact models are required. In this thesis, a physics based Virtual Source (VS) compact model is developed for GaN HEMTs targeting RF applications. While the intrinsic current and charge model are developed based on the
The increased difficulty is related to complex 2D effects specific to asymmetric high voltage device architectures. This thesis presents the compact modeling of high voltage devices. First, a highly scalable general high voltage MOSFET model, for the first time, is presented, which can be used for any high voltage MOSFET with extended drift ...
Rashid, A. (2021). An Accurate and Efficient Electro-thermal Compact Model of SiC Power MOSFET including Third Quadrant Behavior. Graduate Theses and Dissertations Retrieved from https://scholarworks.uark.edu/etd/4088. Due to narrower bandgap and lower critical electric field, silicon (Si) power devices have reached their limit in terms of the ...
In this thesis, a physics-based compact model including impact ionization, associ- ated snapback, and self-heating in SOI-LDMOS is presented. The model explains the snapback effect observed in these devices which is due to the turn-on of lateral par- asitic bipolar transistor (BJT). Compact model described in [31] is used for channel current ...
A Negative Capacitance FET (NCFET) with a ferroelectric (FE) material used as the gate oxide can operate at a subthreshold swing less than the fundamental Boltzmann limit of 60 mV/decade [1]-[5]. In the last few years, a number of proof-of-concept demonstrations of negative capacitance have been achieved [6]-[11].
A PHYSICS-BASED COMPACT MODEL FOR THERMOELECTRIC DEVICES A Thesis Submitted to the Faculty of Purdue University by Kyle Conrad In Partial Ful llment of the Requirements for the Degree of Master of Science in Electrical and Computer Engineering May 2015 Purdue University West Lafayette, Indiana
Speed of evaluation. Circuit simulation speed and accuracy is critical for timely design. Avoid expensive math functions. Avoid Internal nodes, if possible. Model stability and convergence is important. Model evaluations that result in 0/0, but have a physical limit need to be carefully dealt with.
Learn how to develop a physics-based analytical compact model for nanoscale devices, using TCAD simulation and experimental data from Oak Ridge National Laboratory.
anisms are often not completely understood. This thesis explores the nature of gallium nitride devices from the point of view of compact modeling paying particu-lar attention to power electronic applications. To model the behaviour of such de-vices, the physics of the typical AlGaN/GaN Schottky HEMT is studied by solving
Compact Model: 2. Analog/RF behavior of FinFET. 3. Core Model for FinFETs. 4. Channel Current and Real Device Effects. 5. Leakage Currents. 6. Charge, Capacitance and Non -Quasi-Static ... PhD thesis, University of California at Berkeley, 2015. Linear capacitor: Parabolic, 06/21/2019 Yogesh Chauhan, IIT Kanpur. 23.
In this letter, we proposed a dynamic compact model for metal-ferroelectric-semiconductor (MFS) ferroelectric tunnel junctions (FTJ) based on their device physics. The voltage control over dynamic polarizations and the semiconductor surface potentials is achieved for full-region operations, supporting complex FTJ state transitions. A unified and smooth current model across different regions ...
Verilog-A was recently enhanced to provide greater support for compact modeling. In order for Verilog-A to become the standard language for compact model development and implementation, two more steps are necessary: compact model developers must become familiar with the language, and simulators must run compact models written in Verilog-A almost as quickly and reliably as those hand-coded in C ...
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The one product I can talk about, however, is one that I've been most intrigued by ever since the news launched last month: the Marantz Model M1.It's a 2.1-channel amplifier with HEOS-powered ...
The project, to be built by developer Thrive Living and architects AO, was first announced early last year in a press release that revealed renderings of a mixed-use model with multiple floors ...
The new Hyundai EV's compact size makes it perfect for city driving and parking, two critical factors for driving in Europe. ... (~95 hp) in the base model and jumps to 84.5 kW (113 hp) in the ...
A global compact of financial institutions made commitments worth $130 trillion to try to bring down emissions, confident that governments would create a regulatory and financial infrastructure to ...
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